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　　　　　　　　　　2001.1〜2002.7月初め

nanotech*　　　　　　　１３７件
benzo and imidazole　　５１９件

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Abstract: Novel uses of diamondoid-containing materials in the field of microelectronics are disclosed. Embodiments include, but are not limited to, thermally conductive films in integrated circuit packaging, low-k dielectric layers in integrated circuit multilevel interconnects, thermally conductive adhesive films, thermally conductive films in thermoelectric cooling devices, passivation films for integrated circuit devices (ICs), and field emission cathodes. The diamondoids employed in the present invention may be selected from lower diamondoids, as well as the newly provided higher diamondoids, including substituted and unsubstituted diamondoids. The higher diamondoids include tetramantane, pentamantane, hexamantane, heptamantane, octamantane, nonamantane, decamantane, and undecamantane. The diamondoid-containing material may be fabricated as a diamondoid-containing polymer, a diamondoid-containing sintered ceramic, a diamondoid ceramic composite, a CVD diamondoid film, a self-assembled diamondoid film, and a diamondoid-fullerene composite.
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Go to Claims

Detailed Description

DIAMONDOID-CONTAINING MATERIALS

IN MICROELECTRONICS

BACKGROUND OF THE INVENTION

Field of the Invention

[00001] Embodiments of the present invention are directed toward novel uses of both lower and higher diamondoid-containing materials in the field of microelectronics. These

embodiments include, but are not limited to, the use of such materials as heat sinks in 5 microelectronics packaging, passivation films for integrated circuit devices (ICs), low-k dielectric layers in multilevel interconnects, thermally conductive films, including adhesive films, thermoelectric cooling devices, and field emission cathodes.

State of the Art [00002] Carbon-containing materials offer a variety of potential uses in 10 microelectronics. As an element, carbon displays a variety of different structures, some crystalline, some amorphous, and some having regions of both, but each form having a distinct and potentially useful set of properties.

[00003] A review of carbon's structure-property relationships has been presented by S. Prawer in a chapter titled "The Wonderful World of Carbon, " in Physics of Novel Materials 15 (World Scientific, Singapore, 1999), pp. 205-234. Prawer suggests the two most important parameters that may be used to predict the properties of a carbon-containing material are, first, the ratio of sp2 to sp3 bonding in a material, and second, microstructure, including the crystallite size of the material, i.e. the size of its individual grains.

　（中略）

Claims (English)

W H A T IS C L AI M E D IS:

1. A thermally conductive material for removing the heat dissipated by an integrated circuit, the thermally conductive material comprising a diamondoid.

2. The thermally conductive material of claim 1, wherein the diamondoid comprises a diamondoid-containing material.

3. The thermally conductive material of claim 1, wherein the diamondoid comprises a derivatized diamondoid.

4. The thermally conductive material of claim 1, wherein the diamondoid comprises an underivatized diamondoid.

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